| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4ddcb273a108a5d8472b335280098e06 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02118 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-04 |
| filingDate |
1990-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8855d10e7dcf48192d8daa35f1f21185
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f560158abaf5642423c9b9f3b920220
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_726c0760bf801e174a4995c758eed8dc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8661c4f0830f5866127cdd8b28cc04eb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d97b49fe9d9ac8a98f6255ffcf4af76e |
| publicationDate |
1991-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H034405-A |
| titleOfInvention |
Flattenable dielectric |
| abstract |
PURPOSE: To provide good flattening characteristics and insulation characteristics and enable structuring by constituting a dielectric by a base material of organic polymer having specific high-temperature stability. CONSTITUTION: A dielectric constituted by a base material of organic polymer of high-temperature stability where a solid filler capable of being etched in oxide plasma and having high thermal conductivity and good dielectric characteristics is embedded in a finely distributed state. The filler is up to 30vol.% in quantity and is advantageous in that the material is amorphous carbon containing hydrogen. Thereby, the dielectric has good flattening characteristics and insulation characteristics and low permittivity, low loss factor, and high thermal conductivity and can be also structured. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001098160-A |
| priorityDate |
1989-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |