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filingDate 1989-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1991-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0326752-A
titleOfInvention Resin composition for extrusion molded sheet and electrical insulation board
abstract PURPOSE: To obtain a composition giving an insulation board having smooth surface and high elastic modulus, exhibiting little anisotropy of mechanical properties in MD and TD directions of the sheet, punchable at a low temperature and having high heat-resistance by compounding a polyester with an inorganic compound, a copolymer and a reinforcing material. n CONSTITUTION: The objective composition is produced by compounding (A) 100 pts.wt. of a polyester containing ≥80mol% of ethylene terephthalate recurring unit with (B) 5-30 pts.wt. of an inorganic compound having an average particle diameter of ≤50μm. (C) 0.1-15 pts.wt. of a copolymer composed of 80-99wt.% of an α-olefin and 1-20wt.% of glycidyl methacrylate or glycidyl acrylate and (D) 1-10 pts.wt. of a fibrous reinforcing material. The composition is extrusion molded to form a sheet, which is heat-treated to raise the crystallinity to ≥10% and used as an insulation board. The component D is preferably glass fiber of 0.3-4mm long. n COPYRIGHT: (C)1991,JPO&Japio
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priorityDate 1989-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 44.