http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H03247680-A

Outgoing Links

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00
filingDate 1990-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20134eeaabfda40a1f5c93d31672e970
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publicationDate 1991-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H03247680-A
titleOfInvention Highly heat-resistant bonding film, production and usage thereof
abstract PURPOSE: To obtain the subject film, composed of a chain polyimide resin component and polybismaleimide resin component as essential components and capable of readily producing bonding films excellent in heat resistance, flexibility, etc., and bonding adherends at low temperatures using simple operation. n CONSTITUTION: The objective composition, obtained by adding (B) a bismaleimide resin (e.g. N,N'-m-phenylenebismaleimide) component in an amount of 10-100 pts.wt. based on a polyamic acid in (A) the chain polyimide resin component (polyamic acid) of a chemical structure, expressed by the formula and having ≥60mol% resin with ≤260°C second order transition point to the aforementioned component (A) and capable of contact bonding at ≤250°C. n COPYRIGHT: (C)1991,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000290606-A
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priorityDate 1990-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 23.