http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H03247621-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
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filingDate 1990-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d0f3d7d4925f948764025849a1a81023
publicationDate 1991-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H03247621-A
titleOfInvention Highly heat-resistant epoxy resin composition
abstract PURPOSE: To provide the subject composition containing a specific phenolic compound having imide group, a polyfunctional epoxy compound, a polyfunctional maleimide compound, an inorganic filler and a curing catalyst as essential components, having excellent workability and curability and giving a cured product having excellent heat-resistance and moisture-resistance. n CONSTITUTION: The objective composition contains, as essential components, (A) a phenolic compound having imide group and produced by reacting (i) 100 pts.wt. of a phenolic compound containing allyl group (preferably o-allylphenol, etc.) with (ii) 10-500 pts.wt. of a monomaleimide compound of formula (R 1 is H or OH; Ar is 6-20C bivalent aromatic residue) [preferably N-(4-hydroxyphenyl) maleimide, etc.] at a functional group ratio (maleimide group/allyl group) of 0.5-3.0, (B) a polyfunctional epoxy compound, (C) a polyfunctional maleimide compound (e.g. N,N'-4,4'-diaminodiphenylmethane bismaleimide), (D) an inorganic filler (preferably silica powder) and (E) a curing catalyst (preferably an organic phosphine). n COPYRIGHT: (C)1991,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H06192397-A
priorityDate 1990-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 30.