http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H03240063-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-064 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031 |
| filingDate | 1990-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1c3dbc809dce7c5d9d4d373479ad59c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f2b75c99fda4e28000da74a45b571a5 |
| publicationDate | 1991-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H03240063-A |
| titleOfInvention | Photosensitive resin composition and photosensitive resin composition laminate formed by using this composition |
| abstract | PURPOSE: To obtain the photosensitive resin compsn. having excellent plating resistance by forming a photosensitive film laminated with a layer contg. a carboxyl group-cong. film property imparting polymer, photoplymn. initiator, etc., and specific heterocycic compd. on a base film. n CONSTITUTION: The photosensitive film laminated with the layer cotg. the carboxyl group-contg. film property imparting polymer, photoplymerizable vinyl comp., the photoplymn. initiator or the photopolymn. initiator system and the heterocyclic compd. expressed by formula is formed on the base film. In the formula, Ar denotes an arom. ring which may have a substituent. This photosensitive resin compsn. exhibits an excellent adhesive property to metallic laminates and particularly copper-lined laminates used for printed wiring boards and has the excellent etching property of the underlying metal and etching resistance as well as the excellent characteristics to obviate the generation of plating pits. n COPYRIGHT: (C)1991,JPO&Japio |
| priorityDate | 1990-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458393356 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458397365 |
Total number of triples: 18.