http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H03237126-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00
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filingDate 1990-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d0f3d7d4925f948764025849a1a81023
publicationDate 1991-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H03237126-A
titleOfInvention Highly heat-resistant epoxy resin composition
abstract PURPOSE: To obtain the title composition suitable as a sealing material for semiconductors, having excellent workability, curing properties, heat resistance and water-vapor resistance, comprising a specific imide group-containing phenol compound, polyfunctional epoxy compound, inorganic filler and curing catalyst as essential components. n CONSTITUTION: The objective composition comprising (A) an imide group- containing phenol compound prepared by reacting 100 pts.wt. allyl group- containing phenol compound (preferably o-allylphenol) with 10-500 pts.wt. monomaleimide compound [preferably N-(4-hydroxyphenyl)maleimide] shown by the formula (R 1 is H or OH; Ar is 6-20C bifunctional aromatic residue) so as to give a functional group ratio of maleimide group/allyl group of 0.5-3.0, (B) a polyfunctional epoxy compound (e.g. diglycidyl ether of bisphenol A), (C) an inorganic filler (preferably silica powder) and (D) a curing catalyst (preferably organic phosphine such as triphenylphosphine) as essential components. n COPYRIGHT: (C)1991,JPO&Japio
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priorityDate 1990-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 43.