http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H03229438-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0a6a69da5879eb83f56f6876dba3e3cf |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate | 1990-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5b6f426a3315ad3cee8941b9d05a767 |
| publicationDate | 1991-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H03229438-A |
| titleOfInvention | Evaluation of wire bond connection |
| abstract | PURPOSE: To observe and evaluate the state of connection of the joint of electrode and wire in a simple and plain manner and to contrive to control a process and to improve the quality at the time of wire bonding by grinding and etching the package resin and semiconductor chip of a semiconductor device relative to the connection surface of the electrode and wire to remove the resin and chip. n CONSTITUTION: After the rear surface of a semiconductor device package resin 5 is ground until a semiconductor chip is exposed, etching is conducted by the use of fluorine nitric acid solution and an evaluation sample is obtained through cleaning and drying processes. The joint 3a of the Al electrode of the obtained sample and a wire 3 such as gold streak is not removed by fluorine nitric acid being a silicon etching liquid to remain in the evaluation mQ of the joint 3a of the wire 3. Therefore, the state of connection of the Al electrode and wire is observed simply and the accuracy of evaluation of connection reliability is improved. n COPYRIGHT: (C)1991,JPO&Japio |
| priorityDate | 1990-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.