http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H03223856-A

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filingDate 1990-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6dc2f136bdb247a13c226ff4273b88f
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publicationDate 1991-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H03223856-A
titleOfInvention Photosensitive resin composition
abstract PURPOSE: To provide the photosensitive resin compsn. having a high sensitivity to UV exposing and excellent developability by an aq. alkaline soln. by using a photopolymerizable compd. obtd. by successively bringing a polyadduct by the Michel addition reaction of a novolak type epoxy compd. and (meth)acrylic acid as well as the (meth)acryli acid and polybasic acid anhydride into reaction. n CONSTITUTION: This photopolymirizable compd. is obtd. by bringing the polyadduct by the Michel addition reaction of the novalak type epoxy cmpd. and the (meth)acrylic acid as well as the (meth)acrylic acid and the polybasic acid anhydride into reaction. The novalak type epoxy compd. is exemplified by a phenol novalak type epoxy resin, cresol novalak type epoxy resin, etc., and the polyadduct is expressed by formula I. In the formula I, R denotes hydrogen or methyl group; n denotes ≥1 integer. Succinic anhydride, methyl succinic anhydride, etc., are usable as the polybasic acid anhydride. The high sensitivity to UV exposing and the good developability by the aq. alkaline soln. are obtd. in this way. n COPYRIGHT: (C)1991,JPO&Japio
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priorityDate 1990-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 38.