abstract |
PURPOSE: To obtain the subject composition having excellent compatibility and transparency and useful as an adhesive for electric and electronic parts, etc., by adding a butadiene-modified epoxy resin and a silicone-modified epoxy resin to a specific urethane-modified epoxy resin. n CONSTITUTION: The objective composition is produced by adding (A) 5-400 pts.wt. of a butadiene-modified epoxy resin and/or silicone-modified epoxy resin to (B) 100 pts.wt. of a urethane-modified epoxy resin produced by reacting (i) a compound having epoxy group and hydroxyl group with (ii) a compound having terminal isocyanate group and obtained by the reaction of a polybutylene glycol having a molecular weight of 500-5,000 with a 5-20C aliphatic isocyanate. n COPYRIGHT: (C)1991,JPO&Japio |