http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H03210363-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-17 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-1545 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-353 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031 |
| filingDate | 1990-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a775279f0c73ed34c5dfc3ea631f431f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0fc688915e4d9d3858a7e870ad357099 |
| publicationDate | 1991-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H03210363-A |
| titleOfInvention | Photosensitive resin composition |
| abstract | PURPOSE: To obtain a photosensitive polyimide resin composition having good adhesiveness, low modulus of elasticity, good shelf stability high sensitivity, and high heat resistance by incorporating a specified photosensitizing agent and specified photosensitizing aids into a silicone diamine/polyamic acid copolymer. n CONSTITUTION: A copolymer (A) composed of 0.5-25wt.% silicone diamine of formula I (wherein n is 1 to 50) and 99.5-75wt.% polyamic acid of formula II (wherein R 1 and R 2 are each an aromatic cyclic group; n is 1 or 2; m is 0 to 2) is mixed with essential constituents comprising a photosensitizing agent (B) (an acrylamide of formula III) and photosensitizing aids (C) [an amino-alkyl acrylate of formula IV, a biscoumarin composed (D) of formula V, and an oxazolone compound (E) of formula VI], wherein the amounts of components B, C, D, and E are 100-200 pts.wt., 10-50 pts.wt., 1-10 pts.wt., and 1-20 pts.wt., respectively, based on 100 pts.wt. components A, thus giving a photosensitive resins composition. n COPYRIGHT: (C)1991,JPO&Japio |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020527625-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110892004-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110892004-B |
| priorityDate | 1990-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.