http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H03182585-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_834f7601aa209900c3ea3b4ff2c2f5f1
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filingDate 1989-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_24dff3139001f4a2e3a76f00f9ba1022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e2eb24741d3c2108efd3a38d0637a52a
publicationDate 1991-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H03182585-A
titleOfInvention Epoxy-based adhesive for high performance laminating
abstract PURPOSE: To obtain an epoxy-based high performance laminating adhesive which can be used for the adhesion of electronic circuit constituting materials by causing a first reaction between an isocyanate component and a polyester component and causing a second reaction between the obtained isocyanate/ polyester component and an epoxy component. n CONSTITUTION: An isocyanate component is reacted with one or more types of polyester compounds (the first reaction step). Then, the isocyanate/polyester component obtained in the first reaction step is reacted with one or more epoxy components selected from a bis-epoxy component and a novolak epoxy component (the second reaction step). A combination of the isocyanate/polyester compound obtained in the first reaction step with the epoxy component can be applied to (coated on) the surface of a laminate or a separate first surface. When this first surface is brought into contact with a second surface to cause the second step reaction and thus, a high performance bonding agent is formed. This bonding agent becomes an improved adhesive suitable for use in constituting materials of the electronic field. n COPYRIGHT: (C)1991,JPO
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6002065-A
priorityDate 1989-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 26.