http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H03181199-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aa01c5410c39dc20aa9c870a2abf1b03 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0284 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-05 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03K17-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 |
| filingDate | 1989-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_275b8c723a92174259f2414fddc57869 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0dc817f23858d9ba2d2192f393d4f44e |
| publicationDate | 1991-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H03181199-A |
| titleOfInvention | Electronic device |
| abstract | PURPOSE: To improve heat release effect by mounting and sealing an electronic part not only to a bottom plate of a metal base circuit substrate but also to side plates, that is, to five surfaces in all. n CONSTITUTION: Side plates 11b, 11c are formed right and left and side plates 11d, 11e are formed up and down a central bottom plate 11a of a circuit substrate 11 which is provided with a copper coil pattern through an insulating layer on an Al plate. Heat generating electronic part 13a, IC 13b, resistance, capacity 13c, etc., are soldered to the bottom plate and side plates, and an external lead-out terminal 14 is soldered on side plates 11b, 11c. Soldering is applied by solder cream through an electrical furnace. The terminal 14 has a U-shaped cross section and secures a creeping distance from a copper foil pattern on the side plates 11b, 11c. Side plates are bent at a line L to form a box. Resin is filled into a box and hardened. An inside electronic part and outside lead-out terminal are resin-sealed and completed. Reliability improves because of good heat release effect. n COPYRIGHT: (C)1991,JPO&Japio |
| priorityDate | 1989-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978 |
Total number of triples: 19.