| abstract |
PURPOSE: To prepare the title compsn. with low stress and excellent adhesive properties, processability, high-temp. strengths, resistance to heat and hot water, etc., by compounding an N-substed. bismaleimide compd. and an epoxy resin having a double bond conjugated with an arom. group. n CONSTITUTION: The title compsn. is prepd. by compounding: a maleimide compd. having at least one N-substd. maleimide group in the molecule (e.g. N,N'- diphenylmethanebismaleimide); an epoxy resin having a double bond conjugated with an arom. group (e.g. a compd. of the formula); and if necessary a catalyst (e.g. benzoyl peroxide), a hardener (e.g. diaminodiphenylmethane), an inorg. filler (e.g. silica), etc. The compsn. is suitably used as a molding material, powder coating material, semiconductor device-sealing material, printed circuit board material, etc. n COPYRIGHT: (C)1991,JPO&Japio |