http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H03151694-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 |
| filingDate | 1989-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_137c60203729b7efd9311e9cb0524ac6 |
| publicationDate | 1991-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H03151694-A |
| titleOfInvention | Sealing method for electronic device housing |
| abstract | PURPOSE: To eliminate deformation at a cover or the like by inserting a solder sheet to a junction and laser welding it. n CONSTITUTION: When a cover made of the same iron alloy as that of a vessel is brought into contact with the vessel made of the alloy having a glass terminal and is hermetically sealed, a solder sheet is inserted to the junction of both, and welded by laser irradiation. That is, when a solder sheet 5 is inserted between the vessel 2 for forming a package 1 and a cover 3 and irradiated with a laser, the laser of the power of the degree for melting the solder is sufficient. Accordingly, the temperature rise of the parts of be welded may be low, and hence a stress is small. Thus, a deformation such as warpage of a package is eliminated, and an improper external appearance is eliminated. n COPYRIGHT: (C)1991,JPO&Japio |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7902481-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017535466-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10188005-B2 |
| priorityDate | 1989-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419583196 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID104727 |
Total number of triples: 16.