http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0314890-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3f548ca15b9b5748f1afd80e3d1636ec |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-1515 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3412 |
| filingDate | 1989-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_80ae64955330f23fe2e2c694a4f63554 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_923196cc7afcd2519fb45976650bccf8 |
| publicationDate | 1991-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0314890-A |
| titleOfInvention | Heat-resistant adhesive composition |
| abstract | PURPOSE: To obtain the subject composition excellent in heat resistance, moisture resistance, adhesiveness, electrical characteristics, storage stability, and workability by using a solvent-soluble open-chain polyimide, an adduct polyimide, and an epoxy compound as constituents. n CONSTITUTION: The subject composition contains as essential constituents 5-70wt.% solvent-soluble open-chain polyimide resin (A) of formula I [wherein R 1 is a tetracarboxylic acid residue composed mainly of groups of formula II and containing groups of formula III or IV; R 2 is a diamine residue composed mainly of groups of formula V or VI and containing groups of formula VII or VIII (wherein R 3 to R 6 are each 1-4C alkyl; X is a divalent group, such as CH 2 , O, SO 2 or S; R 7 and R 9 are each a divalent organic group; R 8 and R 10 are each a monovalent organic group; p≥1; q≥1); n≥2]; a reaction product (B) of an unsaturated dicarboxylic acid N,N'- bisimide compound (a) of formula IX (wherein R 11 is a 2C divalent group; R 12 is a divalent group containing C=C), an aminobenzoic acid (b) of formula X (wherein R 13 is H, halogen or alkyl), and an aniline (c) of formula XI (wherein R 14 and R 15 are each H, halogen or an organic group containing no active hydrogen atom); an epoxy compound (C) containing at least two epoxy groups in the molecule; and a cure accelerator (D). n COPYRIGHT: (C)1991,JPO&Japio |
| priorityDate | 1989-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.