http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H03142368-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f97f0fa258a008bf056ad04b7f380dda
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
filingDate 1989-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50194dd32b583ba08ffc9186509e0fff
publicationDate 1991-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H03142368-A
titleOfInvention Ic measuring probe
abstract PURPOSE: To easily cope with a complicated pad arrangement and to reduce the cost by forming projections of plural conductors on the surface of an insulating substrate in the same pattern as the arrangement of signal taking-out electrodes of an IC and providing them with signal taking-out lines. n CONSTITUTION: Plural gold bumps 2...2 and signal taking-out lines 3...3 electrically connected to them are formed on one face of a transparent insulating substrate 1, and these bumps are formed in the same pattern as arrangement of electrode pads 5...5 of an LSI chip 4 to be measured. Pad parts 3a...3a are provided in end parts opposite to ends of taking-out lines 3...3 connected to gold bumps 2...2. The chip 4 is set on a supporting plate together with a measuring instrument, and bumps are formed in positions corresponding to pad parts 3a...3a. The substrate 1 is so pressed that bumps 2...2 are closely brought into contact with pads 5...5. Thus, this device easily copes with even a complicated pad arrangement and the cost is reduced. n COPYRIGHT: (C)1991,JPO&Japio
priorityDate 1989-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23985
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID482532689

Total number of triples: 13.