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filingDate 1989-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d07995352dd4a026688567c045331bcd
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publicationDate 1991-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H03134198-A
titleOfInvention Method for nickel plating on silver solder
abstract PURPOSE: To form an Ni plating layer having an excellent adhesive property by etching the surface of the silver solder with an electrolyte contg. 5- and 6-membered cyclic compds. having -NH-, such as succinic acid imide and glutarimide. n CONSTITUTION: The electrolytic etching soln. contg. ≥1 kinds of the compds. which are 5- and 6-membered cyclic compds. having -NH-, such as succinic acid imide, glutarimide, proline, barbituric acid, uracil, 2-pyrrolidone, 3- pyrrolidone, and 2-pyrrolidone-5-carboxylic acid, is prepd. The silver solder surface is etched by this electrolytic etching soln. and thereafter, the silver solder surface is subjected to Ni plating. The silver can be selectively etched from the silver solder surface by this method and the silver solder surface is made into the fine rugged surface state rich with copper. The Ni plating layer having the good adhesive property is formed on the silver solder surface in this way. n COPYRIGHT: (C)1991,JPO&Japio
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priorityDate 1989-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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