http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H03121112-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_630b360599ea5cf4b5bcbc0c6c0a3e2d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F20-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F222-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F299-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F12-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F212-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-00 |
| filingDate | 1989-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_49228884eb86fcf1f86dd98ff6e2e4dd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c12d7fcd4fc7e1b4991fecac9a870247 |
| publicationDate | 1991-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H03121112-A |
| titleOfInvention | Resin composition for semiconductor sealing |
| abstract | PURPOSE: To obtain a resin composition for semiconductor sealing excellent in flow without detriment to the high heat resistance and high filling properties by using a polymaleimide resin, an allylphenol derivative and a plurality of silicas of different particle diameters. n CONSTITUTION: A resin composition for semiconductor sealing is prepared by mixing a polymaleimide resin (A) of formula I wherein n≥2, and Y is an at least bivalent residue, especially an aromatic group, with an allylphenol derivative (B) of formula II wherein X is C(CH 3 ) 2 , SO 2 , SO, S, O or CO (e.g. 2,2-bis(3- allyl-4-hydroxyphenyl)propane) in an amount of 0.5-1.5 equivalents of the allyl groups per equivalent of the maleimide functional groups of component A and 20-90vol.%, desirably 40-85vol.%, based on the entire, silica component (C) consisting of two groups of silicas of different mean particle diameters selected from groups of silicas of mean particle diameters of 0.05-150μm. The silica of component C consists of spherical silica (Q 1 ) of a mean particle diameter of 5μm and other spherical or broken silicas (Q 2 ) than that silica, and the ratio of the smallest particle diameter of Q 2 to the largest particle diameter of Q 1 is below 2, and the rate of the silica group Q 2 is 20-95vol.%. n COPYRIGHT: (C)1991,JPO&Japio |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021124938-A1 |
| priorityDate | 1989-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.