http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H03105940-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e80d21c729aa6ff53bc0452132800c04
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
filingDate 1989-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_33b4147fe3d5c7ac89b18dff6182c4c2
publicationDate 1991-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H03105940-A
titleOfInvention Probing device for wafer
abstract PURPOSE: To brush the needle of a probing card by installing ceramics for polishing a needle point at the central upper section of a Z stage and mounting a brush for brushing in the X or Y direction of the Z stage. n CONSTITUTION: A Z stage 1 has ceramics 2 for polishing a needle point at a central upper section thereof, and has a brush 3 for brushing at the X or Y directional end thereof. The number of wafers set by a measuring-number housing register is measured during normal measurement, the Z stage 1 is operated in the θ direction under the state in which the Z stage 1 is lifted, the needle of a probing card is polished by the ceramics 2 for polishing the needle point, the Z stage 1 is lowered, and moved in the X direction or the Y direction and elevated again, the needle of the probing card is brushed by the brush 3 for brushing, adhering aluminum is removed and the oxidized needle point is polished, and operation is returned to normal measurement again. n COPYRIGHT: (C)1991,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6306187-B1
priorityDate 1989-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804

Total number of triples: 14.