http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H027449-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5547f741b25666fc4ae5195cf71a979b |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-319 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-822 |
| filingDate | 1988-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1fd42951c3ee08229d4f48633754f5d8 |
| publicationDate | 1990-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H027449-A |
| titleOfInvention | Semiconductor device |
| abstract | PURPOSE: To automate a characteristic test of an element for characteristic evaluation use by using a sorting test apparatus of a semiconductor chip and to enhance operation efficiency by installing a wiring part where one end is connected to an electrode of the element for characteristic evaluation use and the other end is connected to a pad electrode for external circuit connection use via a scribing region. n CONSTITUTION: Element formation regions 2a, 2b are partitioned by a scribing region 1 formed in an N-type silicon substrate; internal circuits are formed individually in the regions 2a, 2b. In a process identical to this, an element 8, for characteristic evaluation use, which contains a P-type well 3 and a P + type diffusion region 7, for substrate contact use, stretched to the substrate is constituted. A pad electrode 9a for input signal connection use is connected to an internal circuit via an N + type diffusion region 10, for gate protective circuit use, formed in the P-type well 3; at the same time, it is connected commonly to a gate electrode 4 via the scribing region 1 by using a wiring part 11a. A probe for measurement use is brought into contact with individual pads 9a to 9c; a characteristic test of the element 8 is executed; after the characteristic test has been completed, the region 1 is cut by a dicing saw system or the like; the element has nothing to do with an operation of a semiconductor chip. n COPYRIGHT: (C)1990,JPO&Japio |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100655066-B1 |
| priorityDate | 1988-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541 |
Total number of triples: 18.