http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0260962-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1374dd16777534b65ad4422333245af8
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
filingDate 1988-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_232b77d695f8450d1d729cce0c06dc33
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b81134578459db57a03ff4143b62e443
publicationDate 1990-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0260962-A
titleOfInvention Polymerizable molding composition containing fine polymer
abstract PURPOSE: To obtain the title composition decreased in local heat buildup in curing in molding and giving a molded item improved in surface properties and dimensional stability by forming a suspension composition containing a polymerizable molding composition and specified organic filler. n CONSTITUTION: A polymerizable molding composition (A) which can form a resin without forming any volatile component when cured, for example, styrene, is mixed with a fine polymer obtained by precipitation from a solution containing a liquid polymerizable component constituting A or part of A and a polymer (B) which forms fine polymer, for example, an unsaturated polyester (the mixing ratio is generally such that 0.5-50 pts.wt. B is present per 100 pts.wt. A) to form a polymerizable molding composition comprising a matrix of A in which B is homogeneously dispersed. n COPYRIGHT: (C)1990,JPO&Japio
priorityDate 1988-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID456653168
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7501

Total number of triples: 13.