http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H024888-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386 |
classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
filingDate | 1988-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51f7997813cc8fa5ff9b4a0186670cb5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1cd1defb2061e8dc5a4ebb662115d5e9 |
publicationDate | 1990-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-H024888-A |
titleOfInvention | Adhesive composition |
abstract | PURPOSE: To provide the title composition giving both improved heat resistance and adhesive force at elevated temperatures, for use in metallic foils in laminates, comprising a blended epoxy resin, butyral resin, phenol-novolak resin oligomer and imidazole-based compound. n CONSTITUTION: The objective composition can be obtained by incorporating pref. (A) 100 pts.wt. of an epoxy resin prepared by blending (1) a diphenylpropane novolak resin with (2) an epichlorohydrin-bisphenol in the weight ratio (1):(2)=(25:75)-(50:50) with (B) 20-40 pts.wt. of a butyral resin, (C) 25-45 pts.wt. of a phenol novolak resin oligomer and (D) an imidazole-based compound. n COPYRIGHT: (C)1990,JPO&Japio |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020066592-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210068325-A |
priorityDate | 1988-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.