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Outgoing Links

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32
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filingDate 1988-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_527a4df44d12b0e43d3c843fa2d80a22
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publicationDate 1990-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0241315-A
titleOfInvention Epoxy resin composition
abstract PURPOSE: To obtain the subject composition, good in elastic modulus, hardness and heat resistance. excellent in toughness and useful as civil engineering and building materials, etc., by mixing a bisphenol A-based epoxy resin with plural epoxy resin curing agents. n CONSTITUTION: The objective composition obtained by blending (A) a bisphenol A-based epoxy resin having 450-700 number-average molecular weight and 1.3-3.0 ratio of weight-average molecular weight/number-average molecular weight and (B) an epoxy resin curing agent of a mixed system prepared by mixing (i) one or plural kinds of epoxy resin curing agents selected from amine-based curing agents, such as aliphatic and aromatic amines, phenolic curing agents, such as bisphenols and phenolic resins, and acid anhydrides, such as maleic and succinic anhydrides, with (ii) an epoxy curing agent expressed by formula I [X is -S-, -O-or formula II (R' and R" are H, lower alkyl or phenyl); Y and Y" are lower alkyl or electron attracting group; R is H or lower alkyl; m and n are 1-4 and represent the number of substituent groups]. n COPYRIGHT: (C)1990,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012153746-A
priorityDate 1988-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 24.