http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H023679-A

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filingDate 1988-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_70af8fdd7e316cbb565b55e3ec7e3432
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publicationDate 1990-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H023679-A
titleOfInvention Novel curing type fluorine-containing polyimide
abstract NEW MATERIAL:A compound expressed by formula I (A 1 is formula II or R 2 -R 2 '; A 2 is formula III or A 2 '; A 2 ' is formula IV or V; R 1 is residue after removing two acid anhydride groups from aromatic tetracarboxylic acid; R 2 is residue after removing two NH 2 from aromatic diamine; Z is H or 1-5C alkyl; n is a number of 0-90; at least one of R 1 and R 2 present in the formula is CXY; X and Y are formula VI or further Y is H, 1-8C alkyl or 1-8C fluoroalkyl; Rf and R'f are perfluoroalkyl, Rf is 1-10C and R'f is 1-12C; p is 1, 2 or 3; q is an integer of 0-3; r is 0 or 1; s is an integer of 0-5). n EXAMPLE: A compound expressed by formula VII (the average number of n is 1-0). n USE: A curing type fluorine-containing polyimide, excellent in acid resistance and capable of providing cured materials having a low dielectric constant and refractive index. n PREPARATION: Both compounds expressed by formula VIII and the formula R 2 (NH 2 ) 2 are reacted and the resultant product is reacted with ethynylaniline. The obtained amic acid is subsequently imidated to afford the compound expressed by formula I (A 1 is formula II; A 2 is formula III; n is not 0). n COPYRIGHT: (C)1990,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011173827-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009522612-A
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type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 33.