http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H02310381-A

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-36
filingDate 1989-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_653497b2fcb0ee4f53bb259ea368c085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_127f32f50b2f83d70d59264838de4969
publicationDate 1990-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H02310381-A
titleOfInvention Etching solution for forming fine circuit
abstract PURPOSE: To sharply etch metallic foil stuck on an insulating substrate without causing underetching by using an aq. soln. contg. alkaline compd. and an oxidizing agent as an etching soln. for producing a printed circuit board. n CONSTITUTION: Metallic foil such as Al foil is stuck on an insulating substrate, a circuit pattern is transferred to the foil with an etching resist by screen printing or other method and the unnecessary part of the foil is removed by etching with an etching soln. to produce a printed circuit board having a circuit pattern of the metallic foil. At this time, an aq. soln. contg. 1-25wt.% alkaline compd. such as LiOH, KOH, NaOH or other alkali metal hydroxide and an oxidizing agent such as HClO, HClO 2 , HBrO, HBrO 2 , HIO or HIO 2 is used as the etching soln. The oxidizing agent is added to such a degree that the generation of gaseous H 2 during etching is prevented. An Al circuit having a sharp border line can be formed without underetching the Al foil. n COPYRIGHT: (C)1990,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0395928-A
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priorityDate 1989-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 31.