http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H02298422-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d7576285d411d00c697e07270d2814a |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23D79-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23D67-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 |
| filingDate | 1989-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b629c1f3f89bc909e0f10cde76e0f2f2 |
| publicationDate | 1990-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H02298422-A |
| titleOfInvention | Contact solder alloy film removing jig for measurement of semiconductor device |
| abstract | PURPOSE: To cut off an adhered alloy film on the surface of a contact for measurement without stopping a line, so as to eliminate contact failure by putting an alloy film removing jig which is similar to the shape of a device to be measured, and which has an integrated contact receiving piece provided with a file-like rough surface into a general measurement line properly. n CONSTITUTION: The shape of a solder alloy film removing jig 1 is similar to the appearance of a semiconductor device to be measured, provided with a main body 1a corresponding to a package and with an integrated contact receiving piece 1b corresponding to a number of lead groups. On a contact face on which the contact receiving piece 1b and a contact shoe 3 for measurement abuts, a file-like rough surface 6a is formed through a plate spring 6. In this structure, by properly inputting the jig 1 as a spare into a work line for measurement, contact actuation is performed in the same way as for a general semiconductor device, so as to easily remove a solder alloy film 5 adhered to the contact shoe surface for measurement by the file-like rough surface 6a of the contact receiving piece 1b. n COPYRIGHT: (C)1990,JPO&Japio |
| priorityDate | 1989-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID104727 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419583196 |
Total number of triples: 16.