http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H02292383-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c186e9ae8cafab5df5c8d80cfa7b0fa1 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-17 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18 |
| filingDate | 1989-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_deec7dc60a020b4eccf481775b32e976 |
| publicationDate | 1990-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H02292383-A |
| titleOfInvention | Adhesive resin composition |
| abstract | PURPOSE: To prepare an adhesive resin compsn. useful for adhering polyimide film to copper foil and excellent in the initial adhesive strength and resistance to soldering heat by compounding a specific ethylene copolymer with an unsatd. monomer and a novolak epoxy resin each having a number of unsatd. bonds and each in a specified quantity. n CONSTITUTION: 100 pts.wt. ethylene copolymer having ethylene and ethyl acrylate as the main repeating units and graft polymerized with an alkoxysilane (e.g. γ-methacryloxypropyltrimethoxysilane) is compounded with a monomer having a number of unsatd. bonds (e.g. trimethylolpropane triacrylate) and a novolak epoxy resin having a number of unsatd. bonds (e.g. acrylic-modified phenol novolak epoxy resin) in a quantity of the sum of the monomer and the epoxy resin of 20 pts.wt. or less. n COPYRIGHT: (C)1990,JPO&Japio |
| priorityDate | 1989-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.