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classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D179-08
filingDate 1989-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c44302da7b640225dee8d751ac01583d
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publicationDate 1990-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H02283729-A
titleOfInvention Addition type imide resin composition
abstract PURPOSE: To obtain an addition type imide resin composition which, when formed into a varnish, has a long pot life, mild reactivity and excellent moldability and is useful for a printed wiring board or the like by mixing an unsaturated bisimide with a diamine of a specified structure as a resin compo nent. n CONSTITUTION: An addition type imide resin composition is prepared by mixing an unsaturated bisimide (A) (e.g. N,N'-m-phenylenebismaleimide) with a diamine (B) of the formula (wherein at least either X 1 or X 2 is an electron-withdrawing substituent bonded to the benzene ring in the position ortho and/or para to the amino group, an electron-donating substituent bonded to the benzene ring in the position meta to the amide group or a bulky substituent bonded to the benzene ring in the position ortho to the amino group; (n)≥0, (a)=0-4 and (b)=0-4 (provided that (a) and (b) cannot be simultaneously 0) (e.g. 2,5-dichloro- phenylenediamine) in a molar ratio A/B or 0.5/1.0-10.0/1.0. n COPYRIGHT: (C)1990,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6391983-B1
priorityDate 1989-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 23.