| abstract |
PURPOSE:To process a multilayer wiring board promptly under the same laser condition by advancing laser processing in a conductor wiring layer, which is treated so that layer energy may be absorbed, in a multilayer wiring board, and stopping the laser processing at the surface of the conductor wiring layer, which is treated so that the laser energy may be reflected. CONSTITUTION:The conductor wiring layers of the first layer 2a, the second layer 2b, and the third layer 2c, which are made of materials reflecting lasers, are formed in an insulating material on an alumina ceramic substrate 7. Xe pulse lasers 8 are applied from above the roughened part 6 at output of 0.1mj/P onto this conductor wiring layer. By irradiation with this pulse lasers 8 boring processing at the roughened part 6 is done, and in the extent of 0.1mj/P for output the lasers are reflected at the electric copper plating to which roughened treatment is not applied. While, the laser processing advances at the electric copper plating material to which the treatment to absorb laser energy, such as roughening, etc., is applied, and there an electric contact part 9 is formed at the content part with the second layer 2a. |