| abstract |
PURPOSE: To obtain an epoxy resin composition having high strengths and a high glass transition temperature and being desirable as e.g. a structural hot melt adhesive by mixing a curing agent with a liquid copolymer based on butadiene, etc., and a specified segmented copolymer. n CONSTITUTION: This resin is obtained by mixing an epoxy resin (A) having at least one epoxide group in the molecule with a curing agent (B) which can be activated at high temperatures and used for A (e.g. dicyandiamide), a liquid copolymer (C) based on butadiene, acrylonitrile and optionally other ethylenically unsaturated comonomers and having an average molecular weight of 1,000-5,000 and a segmented copolymer (D) containing formulas Ia and Ib, formula IIa and IIb, formulas IIIa and IIIb or formula IV (wherein the softening points of hard segments represented by formulas Ib, IIb and IIIb and hard segment represented by formula IV are each 25°C or above; R 1 is a unit derived by removing the terminal hydroxyl groups or the like from a polypropylene glycol or the like). n COPYRIGHT: (C)1990,JPO |