http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H02230759-A

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filingDate 1989-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46bc1246472e7687014086cd51dfab81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2c3815fd5d84c0292f737335f55c625
publicationDate 1990-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H02230759-A
titleOfInvention Manufacture of semiconductor element
abstract PURPOSE: To decrease Cl concentration in an interlayer insulating film, and prevent the fluctuation of threshold voltage of an element caused by heat treatment, by making a silicon oxide film containing arsenic oxide and phosphorus oxide an interlayer insulating film. n CONSTITUTION: After a silicon oxide film 12 is stuck and formed, a silicon oxide film 13 containing arsenic oxide and phosphorus oxide is deposited and formed on the whole surface by CVD method using AsCl 3 and PH 3 as source gas. In this case, the content of arsenic oxide and the content of phosphorus oxide in the silicon oxide film 13 are 2-20mol% and 2-9mol%, respectively. Since the silicon film containing arsenic oxide and phosphorus oxide is used as an interlayer insulating film in a semiconductor element formed in this manner, even when heat treatment is performed after plasma silicon nitride film formation, the threshold voltage of a parasitic MOS transistor does not fluctuate as compared with the case where a silicon oxide film containing only arsenic oxide is used as an interlayer insulating film. n COPYRIGHT: (C)1990,JPO&Japio
priorityDate 1989-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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