http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0222887-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 1988-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59e4cf4c6b966dc7b5e40e538760d1a6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6067b0bb69604ac7b27d222adb57edf1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60af421ad70bad925c8296b13a06c0ed |
| publicationDate | 1990-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0222887-A |
| titleOfInvention | Manufacture of thin copper foil clad circuit board |
| abstract | PURPOSE: To obtain a thin copper foil covered circuit board whose copper film has low thickness dispersion and high thickness accuracy by etching whole surface of a copper foil in a copper clad circuit board manufactured from the copper foil and an electric insulator at a predetermined slow speed by using a copper etchant to remove a predetermined proportion of the original thickness of the copper foil to obtain a residual thickness of desired value. n CONSTITUTION: A film, a multilayer shielding plate, etc., whose one side or both sides are covered with a copper foil having a thickness of 18μm, are used as copper foil clad circuit boards. As a electric insulator layer, a film or a sheet of polyester resin, etc., is used. The main agents of a copper etchant are hydrogen peroxide/sulfuric acid, iron chloride, etc., and in case where hydrogen peroxide/sulfuric acid system is used, the respective concentrations are, 2-4w/v% of hydrogen peroxide, 3-7w/v% of sulfuric acid, and at temperature of 25-50°C a copper concentration of 30-60g/l is preferable. The concentrations, the temperature, and contact quantity of the etchant onto the copper foil surface dependent of the spray pressure or the number of nozzles, are adjusted to make the etching spread slow. Thus, the etching speed is made to be 0.05-0.3μm, and the whole surface of the copper foil is etched to remove 25-90% of the original copper foil thickness so that the thickness variations of the frsidual copper foil are made to be within desired thickness ±1.0μm and high density wiring is enabled in subsequent printed wiring manufacturing process. n COPYRIGHT: (C)1990,JPO&Japio |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7230188-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003078234-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1667504-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1923489-A2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1923488-A2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1835052-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7691189-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5316402-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8065794-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114351191-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7827680-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114351191-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002141666-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5462379-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1919266-A2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005340785-A |
| priorityDate | 1988-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 42.