| abstract |
PURPOSE: To make it possible to solder while maintaining high heat resistance by defining the kind and the mixing ratio of stabilized polyisocyanate to be mixed with polyamideimide resin. n CONSTITUTION: An insulation coating material consisting of polyamideimide resin and stabilized polyisocyanate compound, which is prepared from diphenyl diisocyanate in 75-400 pts.wt. per 100 pts.wt. of the resin, is applied on a conductor and baked to obtain an insulating cable. The polyamideimide resin is preferably a reaction product of aromatic tricarboxylic anhydrides or their derivarives with aromatic diisocyantes. The stabilized polyisocyanate compound is preferably diphenylmethane diisocyanate whose isocyanate group is stabilized by a blocking agent. By this, glass transition temperature is elevated, heat resistance is improved. Also, soldering becomes possible. n COPYRIGHT: (C)1990,JPO&Japio |