http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H02183545-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5547f741b25666fc4ae5195cf71a979b |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-01 |
| filingDate | 1989-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56b1460e79fc452778ba622d35c43bb1 |
| publicationDate | 1990-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H02183545-A |
| titleOfInvention | Manufacture of hybrid integrated circuit |
| abstract | PURPOSE: To reduce the residual amount of air at the time of resin encapsulation, prevent the disconnection of a metal thin wire and the deterioration of humidity resistance, and improve reliability by spreading precoating resin on the whole surface of the electronic parts mounting surface of a film circuit substrate. n CONSTITUTION: On a film circuit substrate 2 composed of ceramic and the like and having leads, electronic parts 1A, 1B composed of semiconductor pellets, resistors, etc., are mounted: then the whole part of the electronic parts mounting surface is coated with precoating resin 3 composed of phenol system resin, silicon system resin, etc. After the film circuit substrate 2 is set in a cap 6 composed of resin and the like, the surface is sealed with sealing resin 5. As a result, the whole surface of the film circuit substrate 2 on which the electronic parts 1A, 1B are mounted is coated with precoating resin 3, so that the residual amount of air becomes very small. Thereby, the disconnection of a metal thin wire and the deterioration of humidity resistance are excluded. n COPYRIGHT: (C)1990,JPO&Japio |
| priorityDate | 1989-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.