http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H02181947-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5547f741b25666fc4ae5195cf71a979b |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05554 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-822 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 |
| filingDate | 1989-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b70b49ad8e9e019ac832265fcd4c3d53 |
| publicationDate | 1990-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H02181947-A |
| titleOfInvention | Semiconductor device |
| abstract | PURPOSE: To check a resistance value at a semiconductor chip unit and to remove a detective product at a water stage in its early stage without executing an assembly operation and without evaluating a characteristic by a method wherein a new pad for measurement use is not installed and a checking circuit for a resistance value is built in a semiconductor chip. n CONSTITUTION: A semiconductor device is constituted as follows: bonding pads 2-1 to 2-4 are formed on a semiconductor chip 1; a checking circuit 3, for a resistance value, where two kinds of resistances R 1 , R 2 for checking use have been formed between the bonding pads 2-2, 2-3 is contained. The resistance R 1 is a buried resistance of 400Ω and the resistance R 2 is a diffused resistance of 40KΩ a maximum potential terminal for internal cell use and a maximum potential terminal for output transistor use are used for the bonding pads 2-2, 2-3. When the semiconductor chip 1 is measured, an identical voltage is applied to the bonding pads 2-2, 2-3 and the checking circuit 3 is not influenced. When the resistance value is checked, a potential difference is impressed between the bonding pads 2-2, 2-3 and the resistance is measured. n COPYRIGHT: (C)1990,JPO&Japio |
| priorityDate | 1989-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID962 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419512635 |
Total number of triples: 16.