| abstract |
PURPOSE: To prevent the generation of stress on an element surface even when thermal shock and the like are applied by making the content of filler equal to or less than 2wt.%. n CONSTITUTION: As main material (resin component), the following are used; epoxy resin and polyimide resin composed of two-functionality epoxy compound such as bisphenol A type epoxy resin and bisphenol F type epoxy resin. Filler is contained in resin system adhesive agent by 20% or less, and silica, alumina, and silicon carbide whose average grain diameter is preferably equal to or less than 20μm are used as the filler. Since the spreading amount of resin is controllable, and the film after cured can be controlled so as to be thin (about 5-15μm), the content can be equal to or less than 20%. The elastic modulus of the resin system adhesive agent after cured is 2×10 10 -3.0×10 10 dyn/cm 2 , which is an approximate value of main material itself, thereby absorbing the stress generated by thermal shock and the like. n COPYRIGHT: (C)1990,JPO&Japio |