http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0216579-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45124 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C21-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 1982-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 1990-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0216579-B2 |
| abstract | PURPOSE:To improve reliability and performance of semiconductor element obtained by the resin sealing method by mixing one or both elements of Ni and Cu to the high purity aluminum in the amount of 0.005-0.2wt%. CONSTITUTION:One or both of elements Ni, Cu are mixed to the high purity aluminum used as the Al lead wire in total amount of 0.005-0.2wt%, or respective amount of Ni of 0.005-0.2wt% or Cu of 0.005-0.2wt%. Each of such additives Ni, Cu enhances bonding ability and corrosion resistance. According to the result of experiments, when amount of one or both elements is 0.005wt%, any effect does not appear, but when it exceeds 0.2wt%, the aluminum lead wire becomes hard and the pellet may generate evil crack by the ultrasonic wave bonding method. |
| priorityDate | 1982-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 20.