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filingDate 1988-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_098d16f0f558001dce25fccfcdd17d2d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f05ec25baa7ea08e3411466783027bed
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publicationDate 1990-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H02154264-A
titleOfInvention Photopolymerizable resin composition
abstract PURPOSE: To obtain a photopolymerizable resin compsn. having sufficient resistance to a gold plating soln. by constituting the resin compsn. of each specified pts.wt. of a specified thermoplastic polymer to be used for binder, specified crosslinking monomer, and photopolymn. initiator. n CONSTITUTION: A photopolymerizable resin compsn. is constituted of 40-70pts.wt. thermoplastic polymer for binder obtd. by copolymerizing 3-30wt.% at least one kind among styrenic compd. expressed by the formula I and derivs. thereof substituted in the ring, with 15-45wt.% at least one kind of compd. selected from a group consisting of specified hydroxyalkyl acrylates, 25-60wt.% at least one kind of compd. selected from a group consisting of specified hydroxyalkyl methacrylates, and 15-35wt.% at least one kind of monomers having 3-15C α,β-unsatd. carboxyl groups; 25-50pts.wt. crosslinking monomer consisting of at least one kind of compd. having ≥one ethylenic unsatd. group in a molecule; and 0.1-10pts.wt. photopolymn. initiator. Thus, a photopolymerizable resin compsn. having sufficient resistance to a gold plating soln. is obtd. n COPYRIGHT: (C)1990,JPO&Japio
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priorityDate 1988-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 42.