| abstract |
PURPOSE: To obtain the title composition excellent in electrical insulation properties, heat resistance and adhesion between, for example, a substrate of a printed wiring board and a lead metal layer by crosslinking a mixture comprising a plurality of specified copolymers with a halogenated organic compound and Sb 2 O 3 in a specified ratio. n CONSTITUTION: 100 pts.wt. copolymer component comprising 1-99wt.% copolymer at least comprising units derived from ethylene and units derived from an α,β-unsaturated dicarboxylic anhydride monomer and 99-1wt.% copolymer at least comprising units derived from ethylene and units derived from ethylenically unsaturated epoxy monomer is mixed with 260-390 pts.wt. total of a halogenated organic compound (e.g., decabromodiphenyl oxide) and Sb 2 O 3 , and the obtained mixture is extruded into, for example, a film and crosslinked by hot pressing. n COPYRIGHT: (C)1990,JPO&Japio |