http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H02105817-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7ee684e0af67516b35b42adea885ac25
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68
filingDate 1988-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4eef0ab69a67943aefab30519d1ff38e
publicationDate 1990-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H02105817-A
titleOfInvention Curable epoxy resin composition
abstract PURPOSE: To obtain the title compsn. rapidly curable at lower temp. and providing a cured product with excellent mechanical strength and uniformity by compounding an epoxy resin with a curing agent inactive at ordinary temp. and a curing accelerator comprising a specified pyridine deriv. n CONSTITUTION: An epoxy resin (A) is compounded with a curing agent (B) inactive at ordinary temp. (e.g., dicyandiamine) and a pyridine deriv. (C) having at least one OH group in the molecule (e.g., 3-hydroxypyridine or 2- hydroxymethylpyridine) as a curing accelerator. By compounding furthermore said agent C besides agent B, the obtd. curable epoxy compsn. can be rapidly cured at lower temp. since the agent C exhibits excellent compatibility with the epoxy resin under heating, a cured product with uniform and sufficient mechanical strength can be obtd. n COPYRIGHT: (C)1990,JPO&Japio
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priorityDate 1988-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 29.