http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0197329-A

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filingDate 1987-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2b88f359321f1953766bf79637dd268
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publicationDate 1989-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0197329-A
titleOfInvention Thermoplastic electrical insulating board
abstract PURPOSE: To use small-scale equipment through inexpensive raw material as well as to secure such a thermoplastic electrical insulating board that is excel lent in dimensional stability, chemical resistance, cold stamping workability, soldering heat resistance, etc., by using polyester resin for a matric, and utilizing a crystallized sheetlike molding disusing a ground fabric. n CONSTITUTION: An inorganic compound 5W30pts.wt. of less than 50μ in mean grain size is mixed in a polyester 100pts.wt. with a 1,4-cyclohexanedimethylene terephthalate repetitive unit of more than at least 85mol%. In addition, a copoly mer 1W15pts.wt. consisting of α-olefine 80W99wt.%, glycidylmethacrylate or glycidylacrylate 1W20wt.% and vinyl acetate 0W19wt.%, and a fiber reinforced material 5W50pts.wt. are mixed as well, thereby forming an extrusion molding sheet. Then, heat treatment is carried out at a temperature of less than a melt ing point above a glass transition point of polyester, and thus a thermoplastic electrical insulating board is manufactured with inexpensive raw material. n COPYRIGHT: (C)1989,JPO&Japio
priorityDate 1987-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 23.