http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0196242-A

Outgoing Links

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-02
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filingDate 1987-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af50e4c88636be8466ca505a25d59711
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publicationDate 1989-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0196242-A
titleOfInvention Heat-conductive epoxy resin composition
abstract PURPOSE: To obtain a resin composition having excellent adhesivity, heat- resistance and warm water resistance and extremely excellent heat conductivity, by compounding an epoxy resin composition with a powdery mixture composed of a metallic powder having specific particle size and shape as a filler. n CONSTITUTION: The objective composition contains (A) 100pts.wt. of an epoxy resin (preferably bisphenol A-type epoxy resin), (B) ≥2pts.wt., preferably 4W12pts.wt. of a hardener, preferably fine powder of dicyandiamide containing ≥90wt.% of a fraction having particle diameter of ≤5μm and (C) 40W200pts.wt. (based on 100pts.wt. of A+B) of a mixed powder of metal (preferably Al) composed of (C 1 ) 60W95wt.% of a granular metal powder (or mixture) having an average particle diameter of 5W50μm and containing ≥95wt.% of a fraction having particle diameter of ≤177μm, (C 2 ) 5W40wt.% of acicular metal powder containing ≥95wt.% of a fraction having a length of ≤3μm and a thickness of ≤100μm and, as necessary, (C 3 ) 5W20wt.% of flaky metal powder having a surface area of 0.7W1.2m 2 /g and containing ≥95wt.% of a fraction having a length of ≤88μm and a thickness of ≤5μm. n COPYRIGHT: (C)1989,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0253850-A
priorityDate 1987-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 24.