| abstract |
PURPOSE: To obtain a one-pack epoxy resin composition having a viscosity low enough to be used in sealing with a dispenser and improved in curing rate and storage stability by mixing an epoxy resin with a specified copolymer, a curing agent, a cure accelerator and a filler. n CONSTITUTION: 100 pts.wt. epoxy resin (A) which is liquid as a whole and comprises a liquid epoxy resin and, optionally, a solid epoxy resin is mixed with 5-50 pts.wt. carboxyl group-containing acrylonitrile/butadiene copolymer (B), 1-8 pts.wt. curing agent (C) containing 70-100wt.% at least one imidazole compound of formula I or II [wherein m is 1-14, n is 0-2, R 1-3 are each H, an alkyl or a phenyl, R 4 is H, a (hydroxy)methyl, R 5 is an alkyl or a phenyl], 0.005-2 pts.wt. cure accelerator (D) containing 70-100wt.% at least one organic phosphorus-containing compound selected from among an organic quat. phosphonium salt, an organic tert. phosphine and an organic tert. phosphite and an inorganic filler (E) in an amount of 30-70wt.%, based on the obtained composition. n COPYRIGHT: (C)1989,JPO&Japio |