http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H01283265-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F22-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D491-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D207-452 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F20-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D495-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D209-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F22-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D209-76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D403-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D487-18 |
| filingDate | 1988-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9086f549d9094c6378b92f2cfc10eed8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b8ce6f24af00669be88a6560e62fe37 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3e5d135fabc61919eeba5e8bba30505 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98678deb7fd08d57628a6fe4ba20cb59 |
| publicationDate | 1989-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H01283265-A |
| titleOfInvention | Thioether unsaturated bisimide compound, its production, and composition and cured material containing the same compound |
| abstract | NEW MATERIAL:The thioether unsaturated bisimide compound of formula I (R 1 WR 4 are H, lower alkyl, halogen or fluoroalkyl; R 5 and R 6 are H, lower alkyl or fluoroalkyl; D 1 and D 2 are bivalent organic group having ethylenic unsaturated double bond). n EXAMPLE: 2-2-Bis[4-(4-maleimidophenylthio)phenyl]propane. n USE: A raw material for a polymer useful as an addition-reactive material for imparting heat-resistance to give a cured product having excellent heat- resistance, flexibility and electrical properties and as a resin composition for the sealing of a semiconductor device and extremely effective in improving the moisture-resistant reliability. n PREPARATION: The compound of formula I can be produced by the dehydrative cyclization reaction of a compound of formula II with compounds of formula III and formula IV via an amidic acid intermediate. n COPYRIGHT: (C)1989,JPO&Japio |
| priorityDate | 1988-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.