http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H01281791-A

Outgoing Links

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
filingDate 1988-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e1baf6f4f69578190ab77a8d88fbdac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_594c61149ad572cf9c2583c0659169d5
publicationDate 1989-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H01281791-A
titleOfInvention Prepreg
abstract PURPOSE: To suppress the degradation of an insulation resistance in an electric field at a high temperature and a high humidity by specifying the characteristics of aromatic polyamide fiber base and epoxy resin. n CONSTITUTION: A copper-clad laminated board having silver migration resistant properties can be produced only by employing a prepreg composed of aromatic polyamide fiber base having characteristics of equilibrium moisture content ≤3.0wt.% and extracted sodium ≤80ppm which is impregnated with epoxy resin composition composed of epoxy resin having characteristics of sodium content ≤5ppm and chlorine content ≤600ppm and additives such as specific hardner and curing accelerator. The epoxy resin mainly composed of epoxy resin is compounded with the hardner mainly composed of hardner so as to have the compound ratio of phenolic base equivalent to epoxy equivalent 0.6∼1.3 to make the epoxy resin composition which has the characteristics of sodium content ≤5ppm and chlorine content ≤600ppm. With this constitution, the degradation of an insulation resistance can be suppressed. n COPYRIGHT: (C)1989,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5378869-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5483100-A
priorityDate 1988-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 23.