http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H01257388-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1374dd16777534b65ad4422333245af8 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate | 1988-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e1baf6f4f69578190ab77a8d88fbdac http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_594c61149ad572cf9c2583c0659169d5 |
| publicationDate | 1989-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H01257388-A |
| titleOfInvention | Prepreg and copper-clad laminated board |
| abstract | PURPOSE: To provide both flame retardant properties and humidity-solder resistant properties while high heat resistant properties and peeling strength are maintained by employing a prepreg composed of an aromatic polyamide fiber substrate impregnated with epoxy resin composition. n CONSTITUTION: Epoxy resin mainly composed of specific epoxy resin and hardner mainly composed of specific phenolic hardner are mixed so as to have a phenolic hydroxide radical equivalent ratio of 0.6-1.3 to an epoxy equivalent. After that, additive such as hardening accelerator is added to the epoxy resin composition. A prepreg is composed of an aromatic polyamide fiber substrate impregnated with the epoxy resin composition. Required number of prepreg sheets are laminated and a copper foil is applied to the surface of the laminated prepreg sheets and the copper foil and the prepreg sheets are molded a solid body by pressure heating. The copper-clad laminated board thus obtained has a surface direction linear thermal expansion coefficient as small as that of a silicon bare chip. Therefore, even if the corper-clad laminated board is used as a board for chip-on-board, crackings are not created in a die- bonding part. With this constitution, both flame resistance and humidity-solder resistant properties are provided while high temperature resistant properties, hardness and peeling resistance are maintained. n COPYRIGHT: (C)1989,JPO&Japio |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0498505-A2 |
| priorityDate | 1988-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.