| abstract |
PURPOSE:To obtain the title resin expressed by a specific structural formula, having excellent photosensitive property, heat resistance, mechanical characteristics, insulation characteristics, dielectric characteristics, weather resistance and moisture resistance and useful as a heat-resistant photosensitive material. CONSTITUTION:The aimed resin expressed by formula I (R1 is bivalent aromatic hydrocarbon and contains C-C double bond capable of dimerizing or polymerizing by activation energy beams; n is degree of polymerization). Furthermore, the resin can be produced by reacting a diamine expressed by the formula H2N-R1-NH2 with either one of a dicarboxylic acid expressed by formula II, dicarboxylic acid halide expressed by formula III (X is halide), dicarboxylic acid diester expressed by IV (R' is alkyl or phenyl) and carboxylic acid anhydride expressed by formula V. |