http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H01214098-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29L31-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K33-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K105-20 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F20-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-18 |
| filingDate | 1988-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3fc6e0b1159903524842885dddd1daed http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df2dea821783d4abf992ef23273f8ccc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_477035cf5ac827544972fe88eb26a405 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c53cddd6d858daf1058dfb0352aa2011 |
| publicationDate | 1989-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H01214098-A |
| titleOfInvention | Manufacture of dump-proof and insulated mounting circuit board |
| abstract | PURPOSE:To obtain manufacturing of a mounting circuit board having excellent dump-proof and insulation, and workability and economy by incorporating a filler and a mounting circuit board to a case or mold and by casting resin composition containing a specific dicyclopentadiene derivative, organic acid metallic salt, and peroxide and hardening it. CONSTITUTION:A filler and a mounting circuit board are incorporated in a case or mold. A resin composition containing a dicyclopentadiene derivative expressed by any one of the general equations (I)-(IV), organic acid metallic salt, and peroxide is cast and hardened. R1 in the equation described above has hydrogen or methyl group, and R2 has alkylene group of 2 to 12 carbon atoms, or at least two alkylene chains coupled by at least one oxygen atom and having 4 to 12 carbon atoms, each alkylene chain being of oxaalkylene group containing at least two carbon atoms. As said filler, for example, quartz powder, molten quartz powder, talc, mica, hydrate alumina, calcium carbonate, magnesium carbonate, zircon oxide, etc., is used. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105819722-A |
| priorityDate | 1988-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.