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filingDate 1988-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3700c0f752ae2e5f7b03f626e9a945a0
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publicationDate 1989-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H01201653-A
titleOfInvention Pattern forming material and multilayer wiring board using same
abstract PURPOSE:To improve the heat-resisting property of the title material, and to make possible to form the fine pattern of the material even in case that a thick film is used for the material by composing the material of a silicone polymer, an orthonaphthoquinone type photosensitive agent and an org. compd. having hydroxyl group. CONSTITUTION:The org. compd. having hydroxy group is incorporated in a photosensitive resin composition contg. an alkali - soluble silicon polymer shown by formula I or II and the orthonaphthoquinone type photosensitive agent. In formulas I and II, X is a group selected from the groups comprising a group shown by formula III (wherein R is a hydrocarbon or a substd. hydrocarbon group) and carboxyl group, R1-R4 may be the same or the different with each other, and are each hydroxy, alkyl or phenyl group, (l), (m) and (n) are each 0 or a positive integer, (l) and (m) are not 0 at the same time, (p) is a positive integer. Thus, the pattern forming material which can be formed in thick film with high reliability, is obtd. and the multilayer wiring board using same can be obtd.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013134346-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0436755-A
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Total number of triples: 26.