http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H01168018-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G9-012
filingDate 1987-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de331036700da249c2c87e20ec00d205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5cf877e88f92460c3409922f75881c80
publicationDate 1989-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H01168018-A
titleOfInvention Manufacture of solid electrolytic capacitor
abstract PURPOSE: To prevent a dielectric oxide film from damaging, to rigidly secure a conductor layer, and to effectively electrically and mechanically connect by winding a rodlike cathode lead on an etching foil of anode valve metal in a spiral state, and sequentially forming a semiconductor layer and a conductor layer composed of conductive paste on the surface of the semiconductor layer on the film layer. n CONSTITUTION: A rodlike tin-plated copper cathode lead 3 is placed on a longitudinal end on a tapelike etching aluminum foil 2 formed with an alumina dielectric oxide film layer, and the foil 2 is spirally wound while winding the lead 3. Then, the lead 3 and an anode lead 5 are held by a holder 6, erected in reaction mother solution of aqueous lead acetate trihydrate solution and aqueous ammonium persulfate solution to be dipped, and a semiconductor layer made of lead dioxide and lead sulfate is formed on the film layer. Then, a capacitor element 1 is dipped in silver paste to form a conductor layer, dried and sealed at its port with resin as a solid electrolytic capacitor. n COPYRIGHT: (C)1989,JPO&Japio
priorityDate 1987-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 27.